Line Card

OKAY Industries

OKAY Industries specializes in producing complex metal stampings, automated mechanical and welded assemblies. OKAY has a special expertise with titanium stamping and nitinol stamping services. R&D, product development with concurrent design and build, Production Proven Prototyping®
and rapid tooling services are also provided.

3D Glass Solutions

3D Glass Solutions provides provides high performance 3D RF and Photonic Passive Components. This includes Glass interposers, Antennas, RF discrete components, IPDs and Photonic solutions.. 3DGS is used in IC packaging, Aerospace, Biotechnology, Medical Devices.


InterLnX specializes in the manufacture of Cable Assemblies, Wire Harnesses and Electro Mechanical Assemblies. AS9100 certified.


SemiGen is a full service microwave solutions company that provides
advanced microwave assembly, products and services including high frequency design and test. SemiGen also offers in house RF semiconductor passive devices and thin film capabilities.


IMS is a premier manufacture of Thick Film chip resistors and attenuators. IMS offers non standard sizes and dissimilar terminations with values from .001 ohm to 2T ohm.

Avalanche Technology

Avalanche Technology is the industry leader for discrete and embedded MRAM. This non-volatile memory technology provides many benefits over other NVM’s, specifically lower latency, ultra-low power, infinite endurance, high performance, and small form factors.

BH Electronic

BH Electronics designs and manufactures custom and standard transformers, inductors, filters, baluns, chokes, assemblies and related devices.


HUBER+SUHNER develops and manufactures radio frequency and microwave components and systems for diverse requirements. Our wide product range includes all passive components such as cables, connectors, cable assemblies, antennas, lightning protection and resistive components.


AdTech provides manufacturing capability for multilayer co-fired electronic packages. Materials include Alumina (HTCC), Aluminum Nitride, BeO and LTCC. Chemical Milling services available (step lids, leads, seal rings) in Kovar, Alloy 42, Spring Steel, Stainless Steel


Skywater designs and manufactures semiconductor solutions for the Mil/Aero, Medical, Automotive and Industrial markets. Along with custom ASICs, Skywater offers both passive and active interposers, silicon photonics, sensing and imaging, MEMs, superconducting and Radiation Hardened solutions.



Stellar supplies custom services for metalizations on Alumina, Beryllium Oxide, Aluminum Nitride, or specialty ceramics using a variety of thick film, thin film, refractory and Direct Bond Copper metalizations.


ITAR manufacturer of High-Density Interconnect flex, rigid and rigid flex PCB. Leader in high frequency RF PCB’s, up to 100Ghz

Trusted Semiconductor Solutions

Trusted Semiconductor Solutions provides comprehensive semiconductor solutions including design, fabrication, packaging, test, and inventory management. We specialize in high-reliability microelectronics for military/defense, space, industrial, and avionics applications. Our solutions enable program life extension through legacy part replacements, advanced radiation hardened semiconductors for next-generation aerospace systems, and miniaturization of electronic systems for size, weight, area, and power (SWAP) improvements. DoD Category 1A Trusted Accreditation for design and aggregation services.

BGA Test & Technology

BGA Test & Technology is at the forefront of retinning and reballing technologies. Our processes meet all the quality criteria per GEIA-STD-0006 and the bga reballing standards required by both Military & Aerospace customers. Our innovative systems allows us to provide a cost effective, high quality, quick turn solution. We have invested in the very latest technology, equipment and facility to meet all of our customers current and future needs.

Vario-optics ag

Vario-Optics’ unique electro-optical circuit board technology combines
polymer waveguides with a unique mirror system. This allows the coupling of light perpendicular to the PCB- surface.
The combination of both electronic and optical circuits in one unit leads to massive advantages compared to
conventional PCB technologies.